A resilient 2-D waveguide communication fabric for hybrid wired-wireless NoC design
Article
Agyeman, M., Vien, Q., Ahmadinia, A., Yakovlev, A., Tong, K. and Mak, T. 2017. A resilient 2-D waveguide communication fabric for hybrid wired-wireless NoC design. IEEE Transactions on Parallel and Distributed Systems. 28 (2), pp. 359-373. https://doi.org/10.1109/TPDS.2016.2575836
Type | Article |
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Title | A resilient 2-D waveguide communication fabric for hybrid wired-wireless NoC design |
Authors | Agyeman, M., Vien, Q., Ahmadinia, A., Yakovlev, A., Tong, K. and Mak, T. |
Abstract | Hybrid wired-wireless Network-on-Chip (WiNoC) has emerged as an alternative solution to the poor scalability and performance issues of conventional wireline NoC design for future System-on-Chip (SoC). Existing feasible wireless solution for WiNoCs in the form of millimeter wave (mm-Wave) relies on free space signal radiation which has high power dissipation with high degradation rate in the signal strength per transmission distance. Moreover, over the lossy wireless medium, combining wireless and wireline channels drastically reduces the total reliability of the communication fabric. Surface wave has been proposed as an alternative wireless technology for low power on-chip communication. With the right design considerations, the reliability and performance benefits of the surface wave channel could be extended. In this paper, we propose a surface wave communication fabric for emerging WiNoCs that is able to match the reliability of traditional wireline NoCs. First, we propose a realistic channel model which demonstrates that existing mm-Wave WiNoCs suffers from not only free-space spreading loss (FSSL) but also molecular absorption attenuation (MAA), especially at high frequency band, which reduces the reliability of the system. Consequently, we employ a carefully designed transducer and commercially available thin metal conductor coated with a low cost dielectric material to generate surface wave signals with improved transmission gain. Our experimental results demonstrate that the proposed communication fabric can achieve a 5dB operational bandwidth of about 60GHz around the center frequency (60GHz). By improving the transmission reliability of wireless layer, the proposed communication fabric can improve maximum sustainable load of NoCs by an average of 20:9% and 133:3% compared to existing WiNoCs and wireline NoCs, respectively. |
Keywords | Hybrid wired-wireless Network-on-Chip; reliability; surface wave; mm-Wave; WiNoC; waveguide; wireless channel |
Publisher | IEEE |
Journal | IEEE Transactions on Parallel and Distributed Systems |
ISSN | 1045-9219 |
Electronic | 1558-2183 |
Publication dates | |
Online | 02 Jun 2016 |
01 Feb 2017 | |
Publication process dates | |
Deposited | 23 Jun 2016 |
Accepted | 24 May 2016 |
Output status | Published |
Accepted author manuscript | File Access Level Open |
Copyright Statement | © 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. |
Additional information | The final published article is available Open Access via the IEEE Xplore Digital Library: http://dx.doi.org/10.1109/tpds.2016.2575836 |
Digital Object Identifier (DOI) | https://doi.org/10.1109/TPDS.2016.2575836 |
Web of Science identifier | WOS:000393995600005 |
Language | English |
https://repository.mdx.ac.uk/item/8678x
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